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Agenda www.chiptest.in 3. 0000033254 00000 n Floating licenses which can be shared within a tester or between testers, enable additional capabilities like more speed and more memory while optimizing investments. TEAM A.T.E. Click on more information for further details. verigy 93k tester manual pdf 93k tester pdf 93k tester training pin scale 1600 digital card . Smarter Testing ADVANTEST's V93000 Smart Scale generation incorporates innovative per-pin testing capabilities. bT$nb$Zk5DUVR:;Vj}ow+8S(CfM2r%o90!h-/9' V93000 Direct Probe addresses all major contacting challenges (pad probe, Flip Chip, TSV(Through Silicon Vias) and WLCSP) by supporting contact force up to 300 kg and maintaining planarity (1mm over 44,000mm2) for excellent mechanical and electrical contact quality for large die sizes and in high pin count devices such as with MPUs and GPUs. ]J>\+I4MK{JeT L"||UuRp5L] jz#z F3.!6k:X+L +M X7U>IN4Y/0b = {JUZk;b8Ad6j);ihi[$ ADVANTESTs Wave Scale generation of channel cards for the V93000 platform enable highly parallel multi-site and in-site testing that dramatically reduces the cost of test and ultimately the time to market for current and future devices. For the OSATs the cross generation compatibility means maximum investment protection, optimum reuse of resources and a high degree of flexibility for load balancing within the fleet. TSE: 6857. 0000058497 00000 n 0000008392 00000 n Its modular design makes it easy to extend the system with new modules and instrumentation, as your test needs change. 11 0 obj <> endobj xref 11 73 0000000016 00000 n Requires myAdvantest login and corresponding privileges. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. V93000 Direct Probe interfaces the test head directly with the probe assembly, reducing the length and number of signal path transitions, maintaining signal integrity. 0000031852 00000 n The requirements of today's SoC/SIP industry for ever higher speeds, performance and pin counts means that test systems must offer greater functionality while maintaining low cost of test. In case you have myAdvantest login, but not privileges, please request it via the Contact Form which you can find in the upper right corner on this page. The intent is to provide the skills required to utilize the V93000 tester platform as an integral tool in the engineering and production flows of semiconductor device manufacturing. V93000 Direct Probe 's innovative probe card design, places the probe assembly directly on the load board, improving test performance and reducing hardware cost and hardware design time from design to production. Because of its high integration and decentralized resources, the Advantest V93000 SoC Series offers unprecedented scalability and control. By supporting any combination of the instruments in any of the test heads. The V93000 Port Scale RF architecture makes key contributions in several dimensions: WLCSP require test coverage of final test at probe to enable known good die testing. V93000 - Advantest Contact Information V93000 Service and support information to maximize the use of our products. DUT boards can be exchanged, as well as test programs. 0000001756 00000 n 0000332614 00000 n Advantest Corporation PDF User Guide. The information in the materials on this Web site speaks as of the date issued. Last modified August 12, 2018, ALamat : Gedung Rektorat Lt.4 Kampus Hijau Bumi Tridharma Anduonohu, Kendari, 93131 All Rights Reserved. 0000014447 00000 n The operation area is further expanded by multiple 20-bit high resolution AWGs, floating high current units as well as differential voltmeters, all accessible at every instrument channel. The scalability of the V93000 infrastructure enables cost optimization of configurations and further cost of test reductions can be achieved by: Cost optimization is not only achieved at the tester infrastructure level, but also at card level through the modular design approach maximizing ROI down to the per-pin level: Proven in both engineering and HVM, V93000 solutions are installed in major IDM, design houses and subcontract manufacturers testing a whole range of devices from cost driven digital TV chips through to fully integrated single chip SoC for mobile phones. TSE: 6857. High density instrumentation enables cost efficient parallel testing, Universal per pin architecture with AWG, DGT, DigIO, DiffVM, TMU, high power functionality, Fully pattern based operation for maximizing the test throughput, Floating design to test high- and low-side power structures, Digital Feedback Loop design for flexible and fast load adaption, With Advantest's V93000 Direct Probe solution, manufacturers can now take a major step forward toward complete high performance functional testing at wafer probe and significantly lower cost of test, Maximum test resource utilization, high parallelism and high throughput for lowest cost of test, Shorter hardware development time and cost due to innovative probe card design, High-performance signal integrity from tester pin electronics to probe tip, Mechanically designed for contact force management and planarity to support large surfaces and high pin counts at wafer test, Certified tolerances matching with Advantest made probe card stiffeners for trouble free operation, Probe card cam lock interlock with probe cards which eliminates realignment need after cleaning interval for superior probe cell efficiency, Controlled and specified deflection characteristics for superior contacting robustness even at very high probe counts (50.000), Enables probe test of high pin count MPU/GPU devices requiring high digital performance and high current contacting, Consumer audio/video, mixed-signal and RF devices that are rapidly moving to wafer-level chip scale packaging (WLCSP) and require high performance probe test. The cards advanced architectures allow for highly parallel testing of multiple communication standards or multiple paths within each device, resulting in high multi-site efficiency and a much lower cost of test. 0000062394 00000 n 3DIC test software development, integration and maintenance. Its floating architecture enables stacking of individual sources up to 200V and ganging of multiple channels up to 155A per card. The J750Ex-HD is the most mature and market proven platform for automotive MCU test. 0000013644 00000 n User-specific tests are programmed with test methods in C. Links are . 0000012694 00000 n Advantest 673 subscribers Advantest's Wave Scale generation of channel cards for the V93000 platform delivers unprecedented levels of parallelism and throughput in testing radio-frequency. 0000012048 00000 n 0000160939 00000 n Each channel can provide up to 80V and 10 amps. The drive for more functions per die, the drive for power reduction to enable ever longer battery lifetime of mobile devices drives technology nodes. In addition to the signal quality often the component space is a limitation for higher multisite thus limiting significant cost of test reduction. Whether you need to address very high pin counts, address a high degree of parallelism and multisite efficiency, address large scan data volumes, support sophisticated power delivery or explore very high speeds or timing accuracy, the V93000 provides solutions across the entire space in one go. Increased test coverage, faster time-to-market and superior test economics are achieved with the universal pin architecture on the PS1600 and AVI64 cards, highly integrated RF and mixed signal cards and best-in-class DPS and VI cards. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. ProgramGenerator. The more that could be run in parallel, the greater the test time savings. For Simulation to ATEand. Each of the four classes of V93000 Smart Scale Tester, A, C, S and L, has different sized test heads and provides the most efficient solution for user applications. The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change. Coverage of the digital space from structural wafer sort to high end characterization test, from consumer space to highend, from mobile APU to GPU/CPU and AI devices. Direct Probeis mechanically designed and engineered for contact force management and with the planarity to support large surfaces and high pin counts at wafer test. To remain on pace with the semiconductor technology advances leading to next-generation 5G wireless communications, testing capabilities for RF and mixed-signal ICs must reach new highs in parallelism and throughput. FEb2 V93000 Visionary and Enduring Architecture. More than 1500 switches can be offloaded from the application board into the ATE system to simplify loadboard design. Engineering time is reduced through test program reuse. View and Download Advantest instruction manual online. 0000018675 00000 n 0000010551 00000 n Coverage of the "all digital" space from structural wafer sort to high end characterization test, from consumer space to high end all on one platform providing our customers the benefit of maximum versatility. 0000007396 00000 n The size of the Performance Board is Small and Large, both of which can be connected to all classes of testers. Designed with eight floating channels and four-quadrant operation, the system can be used to provide up to 80 volts and up to 10 amps per channel. Advantest's Direct Probereduces the length and number of signal-path connections between tester pin electronics and probe points, significantly improving signal integrity for device testing. ported to a form factor compatible with Advantest's V93000 test head extension frame, as illustrated in Figure 1. Direct Probe utilizes an innovative probe card based on a single load board that directly incorporates the probe points. The Advantest V93000 SoC Test Platform offers the widest application coverage in the industry, handling the latest generation devices that contain, for example, hi-fi quality audio, video capability, RF and high-speed digital interfaces. Along with the cards 200-MHz bandwidth and various other features including internal loopback and embedded calibration, this ensures a wide application range extending toward future 5G semiconductor devices. In addition, test setup and debug can be performed via interactive user interfaces. 0000009007 00000 n 0000007267 00000 n The Advantest bridge beams are specifically designed to match all application areas, featuring cut outs to provide the required instrument space, so that the new front-end modules can access the DUT interface board / probe card. in a choice of compact, small or large testhead, DUT board reuse and use of the same docking hardware and positioning, which results in a consistent prober and handler setup on the test floor. Verigy V93000 Pin Scale 1600 VelocityCAE. Release 5.4.3. Auto Loading / Unloading Feature for Manual Equipment . By using the same hardware architecture, same test programs, same load boards and same docking, enabling new capabilities to be added over time. With higher quality signals, the control and performance needed for accurate stimulation and full functional testing of digital, mixed-signal and RF devices directly on the wafer is possible. ; Page 3: Table Of Contents Contents Unit 1 Introduction Lesson 1 Training Overview About This Training 15 The Study Material 19 Lesson 2 Introduction to the Test . Both, high current as well as low current switches are integrated on the module and allow separate force/sense signal routing for precise Kelvin connections. User-specific tests are programmed with test methods in C. Links are available for design-to-test conversion. 0000017226 00000 n 0000237580 00000 n Additional efficiencies are gained from the consistent software platform, the same hardware modules from one system to the next (digital, analog, RF, etc.) Working closely with leading probe card manufacturers, Advantest has successfully overcome traditional barriers to delivering high performance test at wafer probe. The V93000 digital test solution is based upon Advantest's proven per-pin architecture, enabling a broad variety of capabilities for the core digital test cases. Highest performance for high-volume manufacturing, multi-site probe test of digital, mixed-signal and RF devices at wafer stage: With greater multi-site testing (up to 32 sites based on test configuration), reduced index times (<1s) and faster test times, manufacturers can achieve the high throughput needed to drive down cost of test. On the low end it needs to cover Power Amplifiers and transceivers on the high end it needs to be able to test devices with multiple RF ports covering a variety of standards combined with mixed signal, digital, power management and embedded or stacked memory testing requirements. The platform has become the all purpose reference platform. 0000013084 00000 n In the past, RF parts were separate, individual "jelly bean" parts. By clicking any link on this page you are giving consent for us to set cookies. This combined with lowest cost of tests results in a widespread market acceptance of the V93000 RF solution and sets a new standard for testing next generation RF devices. Also, is a high precision VI resource for analog applications like power management. With greater multi-site testing, reduced index times (<1s) and faster test times, manufacturers can achieve the high throughput needed to drive down cost of test. Architecturally advanced cards provide the high parallelism and massive multi-site capabilities that allow customers to cost-effectively test current and upcoming generations of communication devices. The test system is designed to provide repeatable device test results and is equipped with software tools to help verify the test program to provide the highest quality testing which is critical in the automotive market. 0000059227 00000 n The current industry standard for wafer prober interface (Pogo Tower) degrades the signal quality because the signal must pass through multiple transition points and a distance of 4 to 5 inches. More information is available at www.advantest.com 0000007005 00000 n ml`)>/d(2Z,KmZ&k)T\c,\h3M/(?Yb+4YhIV5Yhs~q A wireless test solution needs to cover a broad range of devices with different levels of complexity . The result: excellent mechanical and electrical contact is assured. The dual core modules contain resources for both low frequency audio and high frequency capabilities, plus scalability for increasing either the number of source or measure resources, with InstaPin licenses. 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